Microstructure Analysis of TaN/Cu Nanocomposite Coatings Deposited by Pulsed DC Magnetron Sputtering

T. Elangovan; D. Mangalaraj; K. Prabakar; P. Kuppusami; Shabana Khan; E. Mohandas

doi:10.4028/www.scientific.net/AMR.123-125.427

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 123-125Microstructure Analysis of TaN/Cu Nanocomposite...

Microstructure Analysis of TaN/Cu Nanocomposite Coatings Deposited by Pulsed DC Magnetron Sputtering

Abstract:

TaN-Cu nanocomposite thin films used as materials for thin-film resistors (TFR) were prepared by magnetron pulsed dc reactive sputtering. Structural and morphological properties of films deposited on (100) Si as a function of nitrogen flow rate and substrate temperature is investigated. With the introduction of N2 gas flow indicated with different phases of nanocrystalline h-Ta, Ta2N, TaN, Ta4N5 and Cu. XRD analysis of the films deposited with increasing substrate temperature at constant flow rate of nitrogen 10 sccm indicated that the nanocrystalline with bi-phasic (fcc-TaN and fcc-Cu). The microstructure of the films was investigated by scanning electron microscopy and high-resolution transmission electron microscopy.

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Advanced Materials Research (Volumes 123-125)

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427-430

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.123-125.427

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Online since:

August 2010

Authors:

T. Elangovan, D. Mangalaraj, K. Prabakar, P. Kuppusami, Shabana Khan, E. Mohandas

Keywords:

Magnetron Sputtering, Nanocomposite Film, Scanning Electron Microscope (SEM), Tantalum Nitride, TEM

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