Deployable Process Analysis of Packaged SMP Sandwich Beam

Abstract:

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Shape memory polymers own many advantages compared with traditional shape memory alloys or ceramics. In order to improve their shape recovery stress and realize a stable recovery response during the deployable process, the structure of SMP sandwich beam composed of two metallic skin and one SMP core is considered. The recovery behaviors of pure SMP and SMP beams reinforced by one-layer metallic skin are also discussed for comparison. The results confirm that the deployable properties of SMP matrix can be significantly improved by using sandwich structure.

Info:

Periodical:

Advanced Materials Research (Volumes 123-125)

Edited by:

Joong Hee Lee

Pages:

943-946

DOI:

10.4028/www.scientific.net/AMR.123-125.943

Citation:

Z. F. Li and Z. D. Wang, "Deployable Process Analysis of Packaged SMP Sandwich Beam", Advanced Materials Research, Vols. 123-125, pp. 943-946, 2010

Online since:

August 2010

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Price:

$35.00

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