A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers

[1] R.K. Kang, Y.B. Tian, D.M. Guo and Z.J. Jin: Present Status of Research and Application in Ultra-precision Grinding Technology of Large-Scale Silicon Wafers. Diamond & Abrasives Engineering. 2003, 136: 13-18.

Google Scholar

[2] G.C. Wang, Y.X. Zhang: Precision & Non Traditional Machining. Wuhan University of Technology Publications, (2001).

Google Scholar

[3] Kistler Company: Instruction Book of 9251, 9257A, 5001, 5007 Dynamometer (1980).

Google Scholar

[4] Y. Koma, M. Kitano and T. Kouda, U.S. Patent 6, 159, 071. (2000).

Google Scholar

[5] M. Qian, B.Y. Sun, J. Zhang: Investigation and Manufacture of Unitary 3D Piezoelectric Force Measuring Platform. Journal of Dalian University of Technology. 2000, 40(5): 570-572.

Google Scholar

[6] H. Yang: The Key Technology of Ultra-precision Surface Grinding Machining Designing. Aviation Precision Manufanturing Technology. 1995, 32(5): 3-6.

Google Scholar

[7] R.J. Han, F.H. Zhang, H. Niu, D.R. Luan: Research of Ultra-precision Grinding Technology on Si-micro-crystal Glass. Aviation Precision Manufanturing Technology. 1998, 34(2): 17-19.

Google Scholar

[8] R.K. Kang, D.M. Guo, F.W. Huo, Z.J. Jin: Application and Evolution of Back Grinding Technology for Large Size Wafer. Semiconductor Technology. 2003, 28(9): 33-39.

Google Scholar

[9] B.Y. Sun, Y.G. Zhang: Piezoelectric Quartz Force Sensor and Dynamic Cutting Dynamometer. The Publishing Company of Measurement, (1985).

Google Scholar

[10] H.Z. Dai, B.Y. Sun, W.Q. Li, C.Y. Gao: A Multifunctional Loading and Calibrating Device for Force Transducers. Modern Machinery. 2003, 6: 45-46.

Google Scholar