A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers

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A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers

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Periodical:

Advanced Materials Research (Volumes 126-128)

Edited by:

Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso

Pages:

707-712

DOI:

10.4028/www.scientific.net/AMR.126-128.707

Citation:

J. Zhang et al., "A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers", Advanced Materials Research, Vols. 126-128, pp. 707-712, 2010

Online since:

August 2010

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Price:

$35.00

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