Dynamic Constitutive Relation of EMC

Bo Wang; Tong Chen; Xue Feng Shu

doi:10.4028/www.scientific.net/AMR.129-131.988

Paper Titles

Research on Velocity Influence on Thermal Deformation Field of Heavy Hydrostatic Thrust Bearing
p.968

Cutting Path Optimization of Pattern Pieces in Garment Automatic Cutter
p.973

The Numerical Simulation Research of Steam Heating Process of Heated Mandrel Winding
p.978

Yield Line Analysis of Bolted Connections to I-Section Webs
p.983

Dynamic Constitutive Relation of EMC
p.988

Cutting Force Analysis when Milling Ti-6Al-4V under Dry and Near Dry Conditions Using Coated Tungsten Carbides
p.993

Determination of Nanocrystalline Fe₈₀Cr₂₀ Powder Based Alloys Using Williamson-Hall Method
p.999

Tool Wear of PVD Coated Carbide Tool when Finish Turning Inconel 718 under High Speed Machining
p.1004

A Sustainability-Based Building Material Manufacturing Project for Post-Disaster Reconstruction: A Case Study
p.1009

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 129-131Dynamic Constitutive Relation of EMC

Dynamic Constitutive Relation of EMC

Abstract:

In this paper, dynamic properties of EMC were studied at different temperatures and different strain rates. Firstly EMC was investigated by quasi-static tests. Secondly a series of dynamic compressive experiments of EMC were conducted using the Split Hopkinson Pressure Bar (SHPB) at sectional height of strain rates. Thirdly EMC constants in ZWT model were determined from experiments. Corresponding measurements were conducted at temperatures ranging from 20°C to 160°C. The results indicate that the yield strength and flow stress of EMC increase remarkably with the increase of strain rate and it is shows that the assembled curve is fit good accordance with actual the experimental curve. However, the yield strength of EMC is a little change with the increase of temperature which is ranging from 20°C to 160°C.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 129-131)

Pages:

988-992

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.129-131.988

Citation:

Cite this paper

Online since:

August 2010

Authors:

Bo Wang, Tong Chen, Xue Feng Shu

Keywords:

EMC, Split Hopkinson Pressure Bar (SHPB), ZWT Model

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Xie Zhao-wen. The Impact of temperature on the performance of epoxy molding compound. Electronics&Packaging Vol. 7. No. 12. (2007).

Google Scholar

[2] S.L. Liu*, G. Chen, M.S. Yong. EMC characterization and process study for electronics packaging. Thin Solid Films 462-463 (2004) 454- 458.

DOI: 10.1016/j.tsf.2004.05.080

Google Scholar

[3] Lindholm US. Some experiments with the split Hopkinson pressure bar. J. Mech Phys Solids, 1964, 12: 317-335.

DOI: 10.1016/0022-5096(64)90028-6

Google Scholar

[4] Yang H, Min O, Park K. Temperature dependence of dynamic behavior of titanium by the high strain-rate compression test. Proceeding of the Fourth International Symposium on Impact Engineering, 16-18 July 2001, Kumamoto, Japan, vol. Ⅱ, 571-576.

Google Scholar

[5] Lili Wang, Liming Yang. An impact dynamics analysis on a new crash worthy device against ship-bridge collision. International Journal of Impact Engineering 35 (2008) 895-904.

DOI: 10.1016/j.ijimpeng.2007.12.005

Google Scholar