Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process

Jian Xiu Su; Yin Xia Zhang; Jia Xi Du; Ren Ke Kang

doi:10.4028/www.scientific.net/AMR.135.90

Paper Titles

Effect of Material Properties on Aspheric Surfaces Polishing by Compliant Hybrid Position/Force Controlling
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Temperature Distribution of IFA Polishing Single Silicon Wafer
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Analysis of Ultrasonic Honing Chatter Vibration Trajectory
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The Contact Pressure Distribution and its Effects on the Magnetic Disc Substrate Surface Profiles in Chemical Mechanical Polishing
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Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process
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Statistical Analysis of Cutting Forces in Turning Inconel 718 with Coated Carbide Tools
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The Research of the Logarithmic Spiral Axis and NC Machining
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Mechanism Research on Cylinder Liner Groove of the Ultrasonic Plateau-Honing
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Improving the Precision of Gear Honing with External Honing Ring Using Diamond Dressing Gear
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 135Study on Friction Force Distribution on Silicon...

Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process

Abstract:

The friction force on wafer surface plays an important role in removing material of wafer surface and the friction force on wafer surface may have a direct influence on non-uniformity of material removal in wafer CMP process. In this paper, models of friction force on wafer surface were built according to the CMP process. It is proved that the model of the friction force on the wafer surface is correct by the silicon wafer CMP Friction experiment. Then the data fitting of friction model has been done with the experimental data. By the friction force model, the within wafer nonuniformity (WIWNU) of friction force distribution on wafer surface has been obtained with different rotational speed of wafer and polishing pad. The research of this paper is helpful to further understanding the material removal mechanism in wafer CMP.

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Periodical:

Advanced Materials Research (Volume 135)

Pages:

90-95

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.135.90

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Online since:

October 2010

Authors:

Jian Xiu Su, Yin Xia Zhang, Jia Xi Du, Ren Ke Kang

Keywords:

Chemical Mechanical Polishing (CMP), Friction Force, Friction Force Distribution, WIWNU

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References

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DOI: 10.1016/s0040-6090(97)00435-5

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