Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

Jian Hua Zhong; Zhi Hong Li; Ling Yu Ouyang

doi:10.4028/www.scientific.net/AMR.139-141.117

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 139-141Study on the Anti-Oxidant Property of Copper...

Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

Abstract:

In this experiment, the micro copper powders with high temperature of oxidation resistance were prepared by coating with 2 wt.% of silane coupling agent(KH560) solution in order to protect them from oxidation in isotropically conductive adhesives, and X-ray diffraction analysis(XRD), thermo gravimetric analysis(TGA) and accelerated aging test were applied to analyze the anti-oxidant property of the samples before and after they were treated. Experimental results showed that the polymer of silane coupling agent on the surfaces of copper powders had high thermal stability exposed under high temperature and was very effective in preventing the copper powders from oxidation in isotropically conductive adhesives. Besides, the epoxy conductive adhesive sample with plated copper as electrically conductive fillers still had good conductive property even exposed at 160 degrees with its bulk resistivity was 8.75×10-3Ω•cm.

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Periodical:

Advanced Materials Research (Volumes 139-141)

Pages:

117-120

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.139-141.117

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Online since:

October 2010

Authors:

Jian Hua Zhong, Zhi Hong Li, Ling Yu Ouyang

Keywords:

Anti-Oxidant Property, Copper Powder, Epoxy Resin (ER), Isotropically Conductive Adhesives (ICA), Silane Coupling Agent

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