Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

Kai Lin Pan; Jiao Pin Wang; Jing Liu; Guo Tao Ren

doi:10.4028/www.scientific.net/AMR.139-141.1433

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 139-141Numerical Analysis for Thermal Performance of High...

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

Abstract:

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

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Periodical:

Advanced Materials Research (Volumes 139-141)

Pages:

1433-1437

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.139-141.1433

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Online since:

October 2010

Authors:

Kai Lin Pan, Jiao Pin Wang, Jing Liu, Guo Tao Ren

Keywords:

Finite Element Model (FEM), High Power LED, Multi-Chip LED Packaging, Thermal Management, Thermal Resistance Network

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