Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging
Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.
Liangchi Zhang, Chunliang Zhang and Tielin Shi
K. L. Pan et al., "Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging", Advanced Materials Research, Vols. 139-141, pp. 1433-1437, 2010