Design of MEMS High g Accelerometer and Study on the Overload Ability

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Abstract:

Aiming to the application requirements of high overload environment, a MEMS acceleration sensor with high overload ability was designed in this paper. It adopted beam - island structure, which dispersed the stress by the chamfer that was on the root and the end of the structure beam when the acceleration effect on the structure. ANSYS simulation results showed that the structure can improve the ability of anti-overload of the acceleration sensor significantly, and the first- order natural frequency can up to 550 kHz. The designed sensor was processed by the standard processing technology, and the ability of anti-overload of the acceleration sensor was tested by Hopkinson bar. The results of the test showed that the signal and structure of the sensor is normal when the designed acceleration sensor was effected on the 230,000 g. The sensitivity of the senor is 0.88uV/g. In such situation, the designed sensor can meet application requirements of high overload environment effectively.

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Periodical:

Advanced Materials Research (Volumes 139-141)

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1582-1586

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Online since:

October 2010

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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[1] KAL S, DAS S, MAURYA DK, et al. CMOS compatible bulk micromachined silicon piezoresistive accelerometer with low off-axis sensitivity [J]. Microelectronics Journal, 2006, 37: 22-30.

DOI: 10.1016/j.mejo.2005.06.020

Google Scholar

[2] Shi-Xiong Li, Qun-shu, the ancient kernel red. High-g MEMS accelerometer value of current situation and development [J]. Instrument Journal, 2008, 4 (29) : 892-896.

Google Scholar

[3] Quan-Ping Huang. High-range micromachined piezoresistive accelerometers [D]. CAS Shanghai Institute of Microsystem and Information Technology, (2002).

Google Scholar

[4] SHI Yun-bo, Xiao Jin Chi, Liu Jun and so on. Compact, high overload acceleration sensor processing and testing [J]. Mechanical Engineering, 2008, 9 (44) : 200-203.

Google Scholar

[5] Rob O'Reilly, Huy Tang, Wei Chen. High-g Testing of MEMS Devices, and Why [C]. IEEE SENSORS 2008 Conference. 2008: 148-151.

DOI: 10.1109/icsens.2008.4716405

Google Scholar