Numerical Analysis of Thermal Residual Stress in Diamond Film Deposited on Molybdenum Substrate

Chang Long Liu; Da Pei Tang

doi:10.4028/www.scientific.net/AMR.139-141.456

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 139-141Numerical Analysis of Thermal Residual Stress in...

Numerical Analysis of Thermal Residual Stress in Diamond Film Deposited on Molybdenum Substrate

Abstract:

In order to solve the problem of diamond film crack when deposited on molybdenum substrate to improve the preparation quality of diamond film and the rate of finished products , the distributions of thermal residual stress components in diamond film and at interface between the film and molybdenum substrate were simulated by finite element method in the case of whether to consider the plastic deformation of molybdenum substrate or not, moreover, the influence of thermal residual stress upon the failure of film was analyzed. Results show that thermal residual stress is more coincidental with experimental data when the plastic deformation of molybdenum substrate is considered. There are large tensile radial stress and tensile axial stress in the vicinity of upper surface of the film, which is the primary cause for the film to crack.

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Periodical:

Advanced Materials Research (Volumes 139-141)

Pages:

456-459

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.139-141.456

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Online since:

October 2010

Authors:

Chang Long Liu, Da Pei Tang

Keywords:

Diamond Film, Finite Element Model (FEM), Molybdenum Substrate, Thermal Residual Stress

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