Drop Impact Behavior of Packaging System with Irregular Honeycomb Core

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Abstract:

For a product packaging system with honeycomb paperboard, its impact resistance caused by drop impact behavior had been concerned. However, irregular hexagon structure of the paper honeycomb core exists in package business, which is attributable to laggard glue applicator. It has an impact on its impact characteristics. Drop impact behavior of packaging system with irregular honeycomb core has been put forward to know its influence. First, on the basis of theoretical analysis, a series of honeycomb paperboards with different size dimension of paper honeycomb core had been set up in the FEA software. Then a packaging system which made up of rigid body and deformable body had been analyzed. The results show that the physical dimension of paper honeycomb core has a great effect on its impact resistance: with the increasing on degree of irregularity of paper honeycomb core, the peak acceleration has a quickly alteration. At the same time, when the length of glued edge is in near 4 mm and the girth of honeycomb core is 36mm, honeycomb paperboard can improve the energy absorption ability in the condition of elastic deformation. The research results can be used to optimize the structure design.

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Periodical:

Advanced Materials Research (Volumes 146-147)

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127-133

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Online since:

October 2010

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] ZHU Ruo-yan YANG Xiao-jun JIANG Jiu-hong Research on the Shock Characteristic of Honeycomb Cushioning Package System[J] Packaging Engineering 2007(8):96-98.

Google Scholar

[2] Dongmei Wang Impact behavior and energy absorption of paper honeycomb sandwich panels[J] International Journal of Impact Engineering 2009(36): 110–114.

DOI: 10.1016/j.ijimpeng.2008.03.002

Google Scholar

[3] Dong-Mei Wang, Zhi-Wei Wang. Energy absorption diagrams of paper honeycomb sandwich structures [J]. Packaging Technology and Science. 2009, 22(2): 63-67.

DOI: 10.1002/pts.818

Google Scholar

[4] Y.Y. Wang, T.Y. Lin and L. Hua, Drop - impact simulation and experimental verification for spindle fixation of video and audio module (VAM) [J], Mechatronics 13 (2003) (5), pp.427-440.

DOI: 10.1016/s0957-4158(01)00080-0

Google Scholar

[5] LI Xiao-li; GUO Yan-feng; LIU Zhi-peng. Analysis And Discussion Of Shock Characteristic On Cushioning Package System[J], Journal of Shaanxi University of Science Technology2004(22):74-77.

Google Scholar

[6] N.J. Mi11s, Y Masso-Moreu. Finite Element Analysis (FEA) Applied to Polyethylene Foam Cushions in Package Drop Tests[J]. Packaging Technology and Science, 2005, 18: 29-38.

DOI: 10.1002/pts.676

Google Scholar

[7] Jeong-Wook Yia, Gyung-Jin Parkb. Development of a design system for EPS cushioning package of a monitor using axiomatic design [J]. Advances in Engineering Software, 36 (2005): 273-284.

DOI: 10.1016/j.advengsoft.2004.06.016

Google Scholar