Structure and Mechanical Properties of (Cu, Ti) - Binary Metal Doped Diamond-Like Carbon Films

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Abstract:

The composite DLC films doped with different content of Cu, Ti unitary and binary metal have been deposited on stainless steel and silicon substrate using DC-magnetic separation and pulse cathode double-excitation source plasma arc deposition technique. Structural and mechanical properties of the films were investigated by Raman spectroscopy, Atomic Force Microscope, micro-sclerometer and surface profilometer. The results indicated that the hardness and internal stress of Cu-DLC films decrease upon incremental content of copper from 0 to15 at.%. More attractively, a simultaneous improvement of the hardness (31GPa) as well as the release of the internal stress (up to 55%) can be achievable for samples with the relative atomic percentages of Ti and Cu contents of 43.6% and 1.56% respectively.

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Advanced Materials Research (Volumes 150-151)

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217-222

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October 2010

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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