Effects of RE on the Microstructure and Mechanical Properties of Electrodeposited Copper Foil

Abstract:

Electrodeposited copper foil was prepared by direct current electrodeposited method. Effects of different RE additions including 0, 3mg/L, 6mg/L and 9mg/L on the morphology, roughness, and mechanical properties of electrodeposited copper foil are investigated at high current density and high flow rate by SEM (scanning electron microscope), roughness measuring instrument, microcomputer control electronic universal testing machine and high temperature drawing machine. The results reveal that with increasing in RE content, the grain size in the copper foil is refined with more homogeneous distribution and denser, mechanical properties can be improved also. The desirable grain size in the copper foil with maximum value of the mechanical properties and the roughness can be obtained with approximately 6 mg/L RE content.

• Periodical: Advanced Materials Research (Volumes 150-151)
• Pages: 68-71
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.150-151.68
• Online since: October 2010
• Authors: Tian He, Guang Bin Yi, Fen Min Cai, Wen Yi Peng, Xiang Jie Yang
• Keywords: Electrodeposited Copper Foil, Mechanical Property, Microstructure, RE Addition

References

[1] V.A. Vas'ko, I. Tabakovic, S.C. Riemer, et al: Microelectron. Eng Vol. 75 (2004), p.71.

[2] K Kondo, H Murakami: J. Electrochem. Soc Vol. 151 (2002), p. C514.

[3] L Bonou, M Eyraud and R Denoyel, et al: Electrochim. Acta Vol. 47 (2002), p.4139.

[4] L. W. Liu, Q. Y. Wu, B. L. Lu, et al: Electroplat. Pollut. Cont Vol. 24 (2004), p.7.

[5] T. P. Moffat, D Wheeler, D Josell: J. Electrochem. Soc Vol. 151 (2004), p. C262.

[6] Y Zhang and G. C. Li: China. J. Rare. Met Vol. 24 (2000), p.66 (In Chinese).

[7] C. J. Milora, J. F. Henrickson and W. C. Hahn: J. Electrochem. Soc Vol. 120 (1973), p.488.

[8] J. J. Kelly and A. C. West: J. Electrochem. Soc Vol. 145 (1998), p.472.

[9] J. J. Kelly, C. Y. Tian and A. C. West: J. Electrochem. Soc Vol. 146 (1999), p.2540.

[10] K Kondo, N Yamakawa, Z Tanaka, et al: J. Electroanalyt. Chem Vol. 559 (2003), p.137.

[11] D. F. Suarez, F. A. Olson: J. Appl. Electrochem Vol. 22 (1992), p.1002.

[12] M. A. Alodan and W. H. Smyrl: J. Electrochem. Soc Vol. 145 (1998), p.957.

[13] G Fabricius, K Kontturi and G Sundholm: Electrochim. Acta Vol. 39 (1994), p.2353.

[14] C. H. Lee, S. C. Lee and J. J. Kim: Electrochim. Acta Vol. 50 (2005), p.3563.

[15] Q Li, M Gu, X H Xian, et al: Acta. Chim. Sin Vol. 65 (2007), p.881 (In Chinese).

[16] L Mirkova, N Petkova and I Popova, et al: Hydrometallurgy Vol. 6 (1994), p.201.

[17] M. H. Zhu and L. Q. Li: Electroplat. Pollution. Cont vol. 25 (2006), p.46 (In Chinese).

[18] L. J. Chen, Y. P. Kang and H Hong: Electroplat. Finish Vol. 16 (1997), p.41 (In Chinese).

[19] B Hong: Study on texture and internal stress of electrodeposited copper film (doctor dissertation, shanghai: Shanghai Jiao Tong University, 2008) (In Chinese).

[20] S. Z. Zhang, F Ye and T Jiang: Trans. Nonferrous Met. Soc. China Vol. 15 (2005), p.167 (In Chinese).