Structure, Electrical and Optical Properties of Ni-Doped Cu₃N Films Deposited by Radio Frequency Magnetron Sputtering

Abstract:

Ni-doped Cu3N films were prepared by radio frequency (RF) reactive magnetron sputtering method under different N2/(N2+Ar) ratios at room temperature. X-ray diffraction (XRD) patterns show that Ni-doped Cu3N films have the preferred growth along the (100) plane. The lattice parameters of Ni-doped Cu3N films increases obviously compared with the pure Cu3N films, which indicate that some Ni atoms are incorporated into the Cu3N host lattice. The electrical resistivity of Ni-doped Cu3N films has a remarkable change and decreases as the nitrogen ratio decreases. The optical energy gap of Ni-doped Cu3N film is around 1 eV which has no obvious change. The morphology and the thermal stability of doped Cu3N films were also studied.

• Periodical: Advanced Materials Research (Volumes 150-151)
• Pages: 72-75
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.150-151.72
• Online since: October 2010
• Authors: Jun Wang, Jiang Tao Chen, Guang An Zhang
• Keywords: Ni-Doped Cu₃N Film, Structure, Thermal Stability, X-Ray Diffraction (XRD)

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