Thermal and Mechanical Properties of Boron-Containing Bisphenal-A Formaldehyde Resin Composites
Boron-containing bisphenol-A formaldehyde resin (BBAFR) with different amounts of boron was synthesized from bisphenol-A, formaldehyde solution and boric acid. The fiber-glass reinforced laminates were prepared. The thermal, electric and mechanical properties were determined. The results show that the BBAFR has a better thermal stablitity. The residual rate of BBAFR is 18% at 900 oC, which is higher 300 oC than ordinary phenolic resin. The tensile strength of BBAFR fiber-glass laminates is higher 19.07MPa than ordinary phenolic resin fiber-glass laminates. The volume resistivity and surface resistance of BBAFR laminates increased, but the dielectric loss tanδ and dielectric constant ε decreased.
Jinglong Bu, Zhengyi Jiang and Sihai Jiao
J. G. Gao et al., "Thermal and Mechanical Properties of Boron-Containing Bisphenal-A Formaldehyde Resin Composites", Advanced Materials Research, Vols. 150-151, pp. 877-880, 2011