Thermal and Mechanical Properties of Boron-Containing Bisphenal-A Formaldehyde Resin Composites

Abstract:

Boron-containing bisphenol-A formaldehyde resin (BBAFR) with different amounts of boron was synthesized from bisphenol-A, formaldehyde solution and boric acid. The fiber-glass reinforced laminates were prepared. The thermal, electric and mechanical properties were determined. The results show that the BBAFR has a better thermal stablitity. The residual rate of BBAFR is 18% at 900 oC, which is higher 300 oC than ordinary phenolic resin. The tensile strength of BBAFR fiber-glass laminates is higher 19.07MPa than ordinary phenolic resin fiber-glass laminates. The volume resistivity and surface resistance of BBAFR laminates increased, but the dielectric loss tanδ and dielectric constant ε decreased.

• Periodical: Advanced Materials Research (Volumes 150-151)
• Pages: 877-880
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.150-151.877
• Online since: October 2010
• Authors: Jun Gang Gao, Xing Li, Bei Bei Sun
• Keywords: Boron-Containing Bisphenal-A Formaldehyde Resin, Composite, Silsesquioxane (SSO)

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