Study of Immersion Tin Plating on Copper by Galvanic Couple Current Method

Abstract:

Immersion tin (I-Sn) coatings on copper were prepared in a stannous methanesulfonate bath with thiourea being the potential altering agent. The electrochemical displacement process was studied by the galvanic couple current method (GCCM) on an electrochemical workstation. The morphology of the I-Sn coatings were observed by field-emission-gun scanning electron microscopy (FEG-SEM). The I-Sn process can be divided into three stages: (i) rapid increase in galvanic current, (ii) sudden decrease in galvanic current after a peak current, and (iii) low or residual galvanic current stages. It is demonstrated that the galvanic current method is a useful and efficient tool to identify the optimum ending time of the immersion plating process. This optimum immersion time results in a smooth and conformal deposit with a fine grain size.

• Periodical: Advanced Materials Research (Volumes 154-155)
• Pages: 1053-1058
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.154-155.1053
• Online since: October 2010
• Authors: Xue Hua Liu, Dian Tang, Shi Xue Wen
• Keywords: Galvanic Couple Current Method, Immersion Tin Plating, Morpholoy

References

[1] J. Henry: Metal Finishing A Vol. 95 (1997), p.412.

[2] Z.H. Liang, W.Z. Da, Q.Y. Wen, et al: Manual for Electroplating Technology (Mechanical industry Publications, Beijing 1996) (In Chinese).

[3] M.S. Suh, C.J. Park and H.S. Kwon: Surface & Coating Technology Vol. 200 (2006), p.3527.

[4] Q.G. Qian Z.Z. Xichuan and,Z.X. Tian: Japan Patent 1, 121, 673 (1999).

[5] G.P. Zhao, J.L. Fan, and Q. Wen: Electroplating and Finishing Vol. 20 (2001), p.46 (In Chinese).

[6] J.L. Fang: Electroplating and Finishing Vol. 23 (2004), p.22 (In Chinese).

[7] Z.L. Wei and D. Tang: Journal of Fujian University of Technology Vol. 5 (2007), p.11 (In Chinese).

[8] H. Huang, Z.L. Wei, T. Zhang and D. Tang: Metals Heat Treatment Vol. 31(2006), p.64 (In Chinese).

[9] Z.L. Wei and D. Tang: Fujian Metallurgy Vol. 1 (2007), p.1 (In Chinese).

[10] T.Q. Mei and H. Feng: Journal of Nanjing University of Aeronautics and Astronautics Vol. 34 (2002), p.262 (In Chinese).

[11] Editors' Group for Practical Handbook of Chemistry: Practical Handbook of Chemistry (Science Publications, Beijing 2001) (In Chinese).

[12] X.H. Liu and D. Tang: Journal Electroplating & Finishing Vol. 27 (2008), p.20 (In Chinese).

[13] X.X. Jiang and W. Shen: Theory and Practice of Electroless Plating (National Defense Industry Press, Beijing 2000) (In Chinese).

[14] X.H. Liu, D. Tang. Journal of Wuhan University of Technology (Natural Sciences Edition) 2010 (in press) (In Chinese).

[15] J.L. Fang: Theory and Application of Electroplating Additives (National Defense Industry Press, Beijing 2006) (In Chinese).

[16] E. Huttunen-Saarivirta: Surface and Coating Technology Vol. 165 (2003), p.101.

[17] E. Huttunen-Saarivirta, T. Tiainen, T. Lepisto: Materials Science and Engineering A Vol. 336, p.52.

[18] Y. -H. Chen,Y. -Y. Wang, C. -C. Wan: Surface & Coatings Technology Vol. 202, p.417.