The Experimental Research of the Non-Abrasive Cryogenic Polishing on GaAs Chip Surfaces

Abstract:

With the development of mobile communications, gallium arsenide integrated circuits (GaAs IC) have been widely used. For example, satellite communication technology, satellite TV, wireless data transmission, fiber optic communications equipment, automatic test equipment etc. At the same time, it demands that the GaAs chips should have high quality surfaces. In this paper, it takes non-abrasive cryogenic polishing technique to polish GaAs chip surfaces. It has recorded the actual measurement results. The results show that the surface roughness of the ice disk polishing can achieve nanometer scale. Through the research of non-abrasive cryogenic polishing, it has analyzed different parameters on the impact of surface quality.

• Periodical: Advanced Materials Research (Volumes 154-155)
• Pages: 886-890
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.154-155.886
• Online since: October 2010
• Authors: Shou Ping Qu, Zhong Shu Zhang, Tian Zhu Liang
• Keywords: Cryogenic Polishing, GaAs, Non-Abrasive

References

[1] Mingwen Yuan. Applications of GaAs IC(in Chinese). Semiconductor Information. 2000(3): 1-9.

[2] Jianxiu Su, Renke Kang, Dongming Guo. Future Development on Wasfer Planarization Technology in ULSI Fabrication(in Chinese) [J]. Chinese Journal of Mechanical Engineering, 2003, 39(10): 100-105.

DOI: 10.3901/jme.2003.10.100

[3] Shoji D , Shinohara M, Miura T. J . Vac. Sci . Technol . A , 1999 , 17 (2) : 363～372.

[4] P S Sreejith, G Udupa, Y B M Noor, et al. Recent advances in machining of silicon wafers for semiconductor application[J]. International Journal of Advanced Manufacturing Technology, 2001, 17: 157-162.

DOI: 10.1007/s001700170185

[5] Hongxing Yang, Fei Lv, Quan Zhao, Chunxiang Liu. Research of TTV of GaAs polished wafer(in Chinese). Semiconductor Information 2001(5): 55-57.

[6] Rongjiu Han, Hengde Sun, Dequan Xu. Cryogenic Polishing Technology of Monocrystalline Silicon Wafer(in Chinese). Optics and Precision Engineering, 1998(5): 106-111.

[7] Hong Lei, Huazhi Li. Green Fuctions and Comprehensive Benefits of the Low-temperature Processing(in Chinese). Aviation Precision Manufacturing Technology, 1999(03): 44-46.

[8] Yaoneng Liang. Mechanical Engineering Materials(in Chinese). South China University of Technology Press, 2002. 02.

[9] Xiangyan Liu, Lijiang Wang, Chunfu Gao, Xiaosheng Wu, Weina Liu. Experimental Study on Cryogenic Polishing Optical Material Without Abrasive(in Chinese). Chinese Journal of Mechanical Engineering, 2002(06): 51-54.

DOI: 10.3901/jme.2002.06.047