Study on Method of Simulating Dynamic Cushioning Performance of Molded Pulp Packaging Pad

Dong Wei Geng; Wen Cai Xu

doi:10.4028/www.scientific.net/AMR.174.510

Paper Titles

Modified Polypropylene Filled with Nano-Al₂O₃
p.494

Research in Compositions and Coloration Performance of Polyurethane Ink Absorption Coating
p.498

Phase Transformation Conditions on the Structures and Properties of Cellulose Packaging Films in LiCl/DMAc
p.502

Modeling for Dynamic Properties of Honeycomb Paperboard by the Restoring Force-State Mapping Method
p.506

Study on Method of Simulating Dynamic Cushioning Performance of Molded Pulp Packaging Pad
p.510

A Set of Constitutive Models for a Kind of Corn Straw Fiber Based Composite Cushioning Packaging Material
p.513

Research on Bending Resistance of Single Honeycomb Paper-Core
p.517

Research of Flat Crush Performance and Processing Technology for Dual-Core Honeycomb Paperboard
p.521

Research on Preparation and Characterization of Easy-to-Open Tear Tape for Corrugated Carton
p.525

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 174Study on Method of Simulating Dynamic Cushioning...

Study on Method of Simulating Dynamic Cushioning Performance of Molded Pulp Packaging Pad

Abstract:

This paper mainly introduce the ANSYS LS - DYNA software and the detailed simulation of dynamic compression process on molded pulp product, and simulate the acceleration - time curves with the hammer massing 2Kg, and different drop height. when the results were compared to the physical experimentalism , simulation results and physical are consistent. A new method was given to research on the cushioning performance of molded pulp products.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 174)

Pages:

510-512

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.174.510

Citation:

Cite this paper

Online since:

December 2010

Authors:

Dong Wei Geng, Wen Cai Xu

Keywords:

Cushioning Performance, Finite Element Model (FEM), Simulation

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Wang Zhangping, Zhang Yepeng: Packaging Engineering Vol. 27 (2006), p.4.

Google Scholar

[2] Zhang Yepeng, Wang Zhangping and Long Shengrong: Packaging engineering Vol. 27 (2006), p.29.

Google Scholar

[3] Li Houmin, Zhu Ruoyan and Wang Zhangping: Packaging Engineering Vol. 27 (2006), p.8.

Google Scholar

[4] Zhong Yuning, Long Shengrong and Zhang Yepeng: Packaging Engineering Vol. 27 (2006), p.149.

Google Scholar

[5] Shi Dangyong, Li Yuchun and Zhang Shengmin: Explicit power analysis using ANSYS/LS-DYNA 8. 1 (Tsinghua University Press, China 2005).

Google Scholar

[6] Sheng Hetai, Yu Hailiang Fan Xuyi: Principle and Engineering Application's Example of ANSYS Finite Element (Tsinghua University Press, China 2006).

Google Scholar

[7] Ji Hongwei, etc: Packaging Engineering, Vol. 25 (2004), p.168.

Google Scholar