Finite Element Analysis of Pixel Structure of Uncooled Microbolometer for Food Operation Environment

Fu Zhao; Ping Wang; Yan Jue Gong; Li Zhang; Chun Ling Meng

doi:10.4028/www.scientific.net/AMR.179-180.386

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 179-180Finite Element Analysis of Pixel Structure of...

Finite Element Analysis of Pixel Structure of Uncooled Microbolometer for Food Operation Environment

Abstract:

Uncooled infrared bolometer arrays have become mainstream low-cost thermal detector used in applications such as firefighting, security and surveillance, and environment temperature control for food operation. In order to resolve the pixel structure’s stress problem of microbolometer, this paper adopts finite element analysis method to model and analyze the mechanical properties of pixel structure. Several results of the stress and displacement are presented and the influence of structure optimization on the stress is also analyzed quantitatively. The research provides a good foundation and mechanics reference for mechanical design of uncooled microbolometer.

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Periodical:

Advanced Materials Research (Volumes 179-180)

Pages:

386-391

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.179-180.386

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Online since:

January 2011

Authors:

Fu Zhao, Ping Wang, Yan Jue Gong, Li Zhang, Chun Ling Meng

Keywords:

Finite Element Analysis (FEA), Stress, Uncooled Microbolometer Array

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References

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