Numerical Simulation on Splat-Quenched CuCr25 Alloys

Abstract:

The numerical simulation model of rapid solidification splat-quenching CuCr25 alloys was built in this paper. The vacuum chamber, cooling cooper plate and sample were taken into account as a holistic heat system. Based on the heat transfer theory and liquid solidification theory, the heat transfer during the rapids solidification process of CuCr25 flakes prepared by splat-quenching can be approximately modeled by one-dimensional heat conduction equation, so that the temperature distribution and the cooling rate of the flake can be determined by the integration of this equation. The simulative results are coincident very well with the experimental results for the microstructure of rapid solidification splat-quenched CuCr25 alloys.

• Periodical: Advanced Materials Research (Volumes 189-193)
• Pages: 3949-3953
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.3949
• Online since: February 2011
• Authors: Zhi Ming Zhou, Bin Bin Lei, Li Wen Tang, Tao Zhou, Yang Hu, Min Min Cao
• Keywords: Contact Material, CuCr25 Alloy, Numerical Simulation, Splat-Quenching

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