Modal Sensitivity Analysis of PCB

Tao Hu; Ping An Du; John H.L Ha; Jian Tao Liu

doi:10.4028/www.scientific.net/AMR.199-200.1308

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 199-200Modal Sensitivity Analysis of PCB

Modal Sensitivity Analysis of PCB

Abstract:

By studying a typical rectangle PCB, the design parameters affecting natural frequency of PCB are found in the paper. By theoretical deduction and finite element analysis, the sensitivity of the natural frequency of PCB with respect to the design parameters is analyzed, the influence of the design parameters on nature frequency is obtained, and some conclusions for structural optimization of PCB are drawn.

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Periodical:

Advanced Materials Research (Volumes 199-200)

Pages:

1308-1313

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.199-200.1308

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Online since:

February 2011

Authors:

Tao Hu, Ping An Du, John H.L Ha, Jian Tao Liu

Keywords:

Finite Element, Natural Frequency, Sensibility

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References

[1] Yimin Zhang. Mechanical Vibration [M]. Beijing: Tsinghua University Press, 2007: 115-117 (in Chinese).

Google Scholar

[2] Lei Zhang, Rigidity and Modal Analysis and Study on Car Body [D]. Anhui: Hefei University of Technology, 2007 (in Chinese).

Google Scholar

[3] Word Heylen, Stiffen Laments, Paul sas. Modal Analysis Theory and Testing [M]. Beijing, Beijing Institute of Technology Press, (2001).

Google Scholar

[4] Jiyuan Zhu, Dejian Zhou. Study on Board Level Circuit Module and Its Structure Optimization [J]. Electronics Process Technology, 2008, 29(2): 71-73 (in Chinese).

Google Scholar

[5] Fangju Dai. Guohui Cheng. PCB Vibration-Proof Design [J]. Communication Countermeasures, 2004(3): 56-58 (in Chinese).

Google Scholar