Spreading Resistance Analysis of LED by Structure Function

Dong Jing Liu; D.G. Yang; Zhi You; Feng Ze Hou

doi:10.4028/www.scientific.net/AMR.199-200.1501

Paper Titles

Analysis of Thermal Resistence for High-Power Light-Emitting Diodes
p.1482

Modeling for 3-D Temperature Field of Oil-Immersed Transformer
p.1487

Numerical Modeling and Simulation Analysis of Temperature Field of Disc Brake on Trains
p.1492

Study on Vibration Reduction of Finishing Lapping Machine for Bearing Race
p.1496

Spreading Resistance Analysis of LED by Structure Function
p.1501

The Impact of Hybrid Ventilation on Thermal and Energy Performance in Hot and Humid Weather
p.1505

Synthesis Method of Heat Exchanger Network for Distillation Device
p.1509

Inaccuracy of Heat Transfer Characteristics for Pin Fins Considering the Influence of Heat Radiation
p.1513

Numerical Investigation into Thermal Behavior of Brushless Permanent Magnet Motors
p.1518

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 199-200Spreading Resistance Analysis of LED by Structure...

Spreading Resistance Analysis of LED by Structure Function

Abstract:

In this paper, an investigation on structure function of LED for thermal resistance testing is presented. LED was placed on aluminum plate in different locations. Four group experiments were applied to determine thermal resistance of LED. A simple and effective solution is proposed and discussed on the spreading resistance. The experimental results show the relationship between junction temperature and different locations.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 199-200)

Pages:

1501-1504

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.199-200.1501

Citation:

Cite this paper

Online since:

February 2011

Authors:

Dong Jing Liu, D.G. Yang, Zhi You, Feng Ze Hou

Keywords:

LED, Spreading Resistance, Structure Function, Thermal Transient Testing

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Yenshu Chen: Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber. Vol. 129 (2007) , p.349.

Google Scholar

[2] Lan kim and Moo Whan Shin: Thermal resistance Measurement of LED Package with Multichip. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 30 (2007), p.632.

DOI: 10.1109/tcapt.2007.906332

Google Scholar

[3] Seri Lee: Constriction/Spreading resistance model for electronics package. Vol. 4 (1995), p.199.

Google Scholar

[4] Hyun-Ho Kim and Sang-Hyun Choi: Microelectronics Reliability 48(2008), p.449.

Google Scholar

[5] V. Székely and Tran Van Bien: Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-State Electronics, V. 31, pp.1363-1368 (1988).

DOI: 10.1016/0038-1101(88)90099-8

Google Scholar