Effect of Constraints in Cooling Process on the Residual Stress in the Adhesively Bonded Single Lap Steel Joint

Abstract:

The effect of five constraint conditions in cooling process on the residual stress distributed in the adhesively bonded single lap steel joint under a 100°C thermal shock was investigated using the elasto-plastic finite element method (FEM). The results from the numerical simulation show that the effect of constraint model is significantly to the residual stress distributed in both mid-bondline and adherend near the interface of the adhesively bonded single lap steel joint. The constraint to the longitudinal of the adherend is much significantly to the residual stress than that of the transversal one. Comparing the action of the constraint model C and model E, the effect of the model E on the residual stress along the mid-bondline is higher than that of the model C.

• Periodical: Advanced Materials Research (Volumes 230-232)
• Pages: 659-663
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.230-232.659
• Online since: May 2011
• Authors: Min You, Cun Jun Chen, Jiang Cheng Zhang, Jing Rong Hu, Ling Wu
• Keywords: Adhesive, Cooling Process, Residual Stress, Single Lap Joint, Steel, Thermal Shock

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DOI: 10.1016/j.ijadhadh.2010.03.009

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