Characterization of Boron Modified Phenolic Resin and its Curing Behavior

Biao Li; Yun Wu Zheng; Zhi Feng Zheng; Xiong Yue Zhao

doi:10.4028/www.scientific.net/AMR.233-235.137

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 233-235Characterization of Boron Modified Phenolic Resin...

Characterization of Boron Modified Phenolic Resin and its Curing Behavior

Abstract:

Boron modified phenolic (BPF) resins with different boron amounts were synthesized with a special synthesis technology. The structure of BPF resin was analyzed by Fourier transform infrared spectra (FTIR) and its curing behavior was analyzed by differential scanning calorimeter (DSC). The results showed that boric acid reacted with the hydroxyl groups in phenolic resin to form a new cross-linked bond such as B-O. At the same time, the heat resistance of BPF resin was improved about 18% with addition of boric acid of 0.8wt%. The obtained BPF had a high curing temperature of 254.6when the boric acid amount was 0.8wt%.

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Periodical:

Advanced Materials Research (Volumes 233-235)

Pages:

137-141

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.233-235.137

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Online since:

May 2011

Authors:

Biao Li, Yun Wu Zheng, Zhi Feng Zheng, Xiong Yue Zhao

Keywords:

Boron, Differential Scanning Calorimetry (DSC), FT-IR, Phenolic Resin

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