Low Temperature and Low Phosphorus Electroless Nickel Plating

Li Guo Ma; He Liu; Ju Jun Li; Yan Feng He

doi:10.4028/www.scientific.net/AMR.233-235.302

Paper Titles

Study on the Influences of Domain Structure of Hydrophilic Polyurethane with Partially Crystalline on its Moisture Permeability
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The Cyclization of 2-Chloro Nicotinic Acid
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Preparation, Characterization and Application of Siloxane Succinate Fatliquor
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Development and Evaluation on Surfactant Used in Chemical Flooding
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Low Temperature and Low Phosphorus Electroless Nickel Plating
p.302

Synthesis of Carboxymethyl Starch with High Degree of Substitution by a Modified Dry Process
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Photometric Analysis Reagents of Rare Earths and their Application in Metallurgical Analysis
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Effective Aerobic Oxidation of p-Nitrotoluene to p-nitrobenzoic acid Catalyzed by Manganese Dioxide and N-Hydroxyphthalimide
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Synthesis of 2-Chloro-4,6-Diamino-5-Cyanopyrimidine and its Amino-Substituted Derivatives
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 233-235Low Temperature and Low Phosphorus Electroless...

Low Temperature and Low Phosphorus Electroless Nickel Plating

Abstract:

Direct electroless nickel plating on n-Si(100) wafers in alkaline solutions was performed without any activation procedure in advance. The effect of pH and temperature on the size of deposited metal particles was examined. Moreover, The phosphorus contents of deposits were also analyzed by the energy disperse spectroscopy. The results indicated that the optimal reaction temperature was 60°C and the optimal pH value was 10.0 with a plating rate of about 3.0 µm/hr and the phosphorus content of about 3.6 wt%.