Study on Foamed Buffer Material with the Residues of Wheat Straw Pulping

Article Preview

Abstract:

The residues from wheat straw pulping mainly include uncooked chips and fiber bundles. In order to achieve high quality pulp, the residues require removal from the system. It was not necessary that the residues were re-cooked because of its high contents of non-cellulosic constituent. The achievement of low density foamed buffer material with the residues of wheat straw pulping would make the second pollution problem of the residues be solved, and achieve a replacer of foamed plastic material. The paper discussed the producing techniques of foamed buffer material with the residues of wheat straw pulping. The result showed that the best foamed properties of the residues were achieved with proper dosage of natural bonding agent like wheat flour, inorganic foamed agent, crosslink agent, and proper foamed temperature. The density and compression of foamed buffer material with the residues of wheat straw pulping were achieved with 60 kg /m3 and 60 kPa respectively at the optimum foaming condition.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 236-238)

Pages:

1317-1321

Citation:

Online since:

May 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Huai-yu Zhan: China Pulp& Paper Vol. 29(2010), p.56, in Chinese

Google Scholar

[2] Li Yan and Yangyi Wu: Paper and Paper Making Vol. 35(2006), p.23

Google Scholar

[3] Datong Zhang, Xuebin Liu and Zhongzheng Li: China Pulp& Paper Vol. 9(1990), p.16, in Chinese

Google Scholar

[4] Guanglin Luo and Lu Pei: PACKAGING ENGINEERING Vol.28 (2007), p.46, in Chinese

Google Scholar

[5] Zhuang Liu, Lin Zhu and De Gao: PACKAGING ENGINEERING Vol. 27 (2006), p.28, in Chinese

Google Scholar

[6] Xiaohui Jing and Jingxin Yang: PACKAGING ENGINEERING Vol. 20(1999), p.12, in Chinese

Google Scholar

[7] Yanna Lu, Yunzhan Zhang and Janzhi Ou: PACKAGING ENGINEERING Vol. 25 (2004), p.78, in Chinese

Google Scholar