Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

Ying Hui Zhang; Jing Qin; Hong Jin Zhao; Gao Lei Xu

doi:10.4028/www.scientific.net/AMR.239-242.2976

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Interfacial Microstructure Evolution of...

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

Abstract:

The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

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Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

2976-2980

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.239-242.2976

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Online since:

May 2011

Authors:

Ying Hui Zhang, Jing Qin, Hong Jin Zhao, Gao Lei Xu

Keywords:

Annealing Process, Copper/Aluminium Laminate, Interface, Micro-Structure Evolution

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