Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

Abstract:

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The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

2976-2980

DOI:

10.4028/www.scientific.net/AMR.239-242.2976

Citation:

Y. H. Zhang et al., "Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes", Advanced Materials Research, Vols. 239-242, pp. 2976-2980, 2011

Online since:

May 2011

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Price:

$35.00

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