Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes
The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
Y. H. Zhang et al., "Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes", Advanced Materials Research, Vols. 239-242, pp. 2976-2980, 2011