Curing, Thermal and Mechanical Properties of Liquid Crystalline p-SBPEPB/BPAER/DDE System

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Abstract:

The curing, thermal and mechanical properties of bi-component system for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypro pyloxy)benzoate] (p-SBPEPB), with 4,4'-diaminodiphenyl ether (DDE) as a curing agent, were investigated. The effect of the different liquid crystalline contents and the heating rate on curing reaction was discussed. The results show that the curing peak temperature decreases, curing rate increases, the glass transition temperature (Tg) and impact strength all increase with adding of liquid crystalline p-SBPEPB when the content is not over 8wt%.

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Advanced Materials Research (Volumes 239-242)

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3253-3256

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May 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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