Curing, Thermal and Mechanical Properties of Liquid Crystalline p-SBPEPB/BPAER/DDE System

Abstract:

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The curing, thermal and mechanical properties of bi-component system for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypro pyloxy)benzoate] (p-SBPEPB), with 4,4'-diaminodiphenyl ether (DDE) as a curing agent, were investigated. The effect of the different liquid crystalline contents and the heating rate on curing reaction was discussed. The results show that the curing peak temperature decreases, curing rate increases, the glass transition temperature (Tg) and impact strength all increase with adding of liquid crystalline p-SBPEPB when the content is not over 8wt%.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

3253-3256

DOI:

10.4028/www.scientific.net/AMR.239-242.3253

Citation:

L. Huo et al., "Curing, Thermal and Mechanical Properties of Liquid Crystalline p-SBPEPB/BPAER/DDE System", Advanced Materials Research, Vols. 239-242, pp. 3253-3256, 2011

Online since:

May 2011

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Price:

$35.00

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