Phase Composition, Microstructure and Thermal Diffusivity of Cu/Si Composites Sintering Temperature Dependence

Abstract:

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Cu/Si composites may become novel high-performance electronic packaging materials owing to combining the advantages of copper and silicon components. Here, we prepared Cu/Si composites by being sintered below and above eutectic temperature 802 °C, respectively, and found that sintering temperature notably affects their composition, microstructure and thermal diffusivity. The composites sintered at 780 °C are composed of copper and silicon, exhibiting dispersed silicon particles and continuous copper matrix, but those sintered at 820 °C primarily contain Cu3Si compounds, and a porous microstructure is observed. The thermal diffusivity of the former is over 21 times higher than that of the latter.

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Periodical:

Edited by:

George Ferguson, Ashvin Thambyah, Michael A Hodgson and Kelly Wade

Pages:

200-203

DOI:

10.4028/www.scientific.net/AMR.275.200

Citation:

H. Cai et al., "Phase Composition, Microstructure and Thermal Diffusivity of Cu/Si Composites Sintering Temperature Dependence", Advanced Materials Research, Vol. 275, pp. 200-203, 2011

Online since:

July 2011

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$35.00

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