Enhancement of Thermal Conductivity with Carbon-Encapsulated Copper Nano-Particle for Nanofluids

Abstract:

Carbon-encapsulated copper nanoparticles were synthesized by a carbon arc discharge method. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, thermogravimetric and differential scanning calorimetry. The result showed that the outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The dispersion behaviors and thermal conductivity of Carbon-encapsulated copper nanoparticles in water with different dispersants were investigated under different pH values. The results showed that the dispersion and thermal conductivity enhancements of Carbon-encapsulated copper nanoparticles nanofluids are higher than that of copper nanoparticles.

• Periodical: Advanced Materials Research (Volumes 284-286)
• Pages: 801-805
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.284-286.801
• Online since: July 2011
• Authors: Jin Shan Pang, Hai Yan Zhang, Li Ping Li
• Keywords: Carbon-Encapsulated Copper Nanoparticles, Nanofluid, Thermal Conductivity (TC)

References

[1] S.U.S. Choi, ASME 231 (1995) 99.

[2] K. Hong, T.-K. Hong, H.-S. Yang, Appl. Phys. Lett. 88 (3) (2006) 31901.

[3] C.H. Li, G.P. Peterson, J. Appl. Phys. 99 (8) (2006) 084314.

[4] S.K. Das, N. Putra, P. Thiesen, W. Roetzel, J. Heat Transfer 125 (2003) 567.

[5] Y.M. Xuan, Q. Li, W. Hu, AIChE J. 49 (2003) 1038.

[6] J.A. Eastman, S.U.S. Choi, S. Li, L.J. Thompson, Mater. Res. Soc. 457 (1997) 3.

[7] J.A. Eastman, S.U.S. Choi, S. Li, W. Yu, L.J. Thompson, Appl. Phys. Lett. 78 (2001) 718.

[8] S. Lee, S.U.S. Choi, S. Li, J.A. Eastman, J. Heat Transfer 121 (1999) 280.

[9] X.F. Li, D.S. Zhu, Chem. Ind. Eng. Prog. 25 (2006) 875.

[10] Y.M. Xuan, Q. Li, Int. J. Heat Fluid Flow 21 (2000) 58.

[11] S.M.S. Murshed, K.C. Leong, C. Yang, Int. J. Therm. Sci. 44 (2005) 367.

[12] X.F. Li, D.S. Zhu, X.J. Wang, J. Colloid Interface Sci. 310 (2007) 456.

[13] J.A. Eastman, S.U.S. Choi, S. Li,W. Yu, L.J. Thompson, Appl. Phys. Lett.78 (2001) 718.

[14] H. Xie, H. Lee, W. Youn, M. Choi, J. Appl. Phys. 94 (2003) 4967.

[15] S.U.S. Choi, Z.G. Zhang,W. Yu, F.E. Lockwood, E.A. Grulke, Appl. Phys.Lett. 79 (2001) 2252.

[16] M.J. Biercuk, M.C. Llaguno, M. Radosavljevic, J.K. Hyun, A.T. Johnson,Appl. Phys. Lett. 80 (2002) 2767.

[17] B.M. Ginzburg, L.A. Shibaev, O.F. Kireenko, Russ. J. Appl. Chem. 75 (2002) 1330.

[18] J.A. Eastman, S.U.S. Choi, S. Li, W. Yu, L.J. Thompson, Appl. Phys. Lett.78 (6) (2001) 718

[19] Dongsheng Zhu, Xinfang Li , Nan Wang. Current Applied Physics 9 (2009) 131.

[20] J.I. Pascual, J.Mendez , J.Gomez-Herrero et al . Science , 1995 ,267(5205) 1793

[21] P.G. Collins, A.Zettl , H.Bando et al . Science , 1997 ,278 (5335) 100

[22] K.Bubkle , H.Gnewuch , M.Hempstead et al . Appl . Phys. Lett . ,1997 ,71 (14) (1906)

[23] XL Dong, Z D Zhang , S R Jin et al . J . Mater. Res. , 1999 ,14 (5):1782

[24] Haitao Zhu, Canying Zhang, Appl. Phys. Lett. 89 (2006) 023123.

[25] J.A. Reglero, D. Lehmhus, M. Wichmann J.A. in: International Conference Advanced Metallic Materials, Smolenice Slovakia, November 2003, p.253.