Enhancement of Thermal Conductivity with Carbon-Encapsulated Copper Nano-Particle for Nanofluids

Abstract:

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Carbon-encapsulated copper nanoparticles were synthesized by a carbon arc discharge method. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, thermogravimetric and differential scanning calorimetry. The result showed that the outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The dispersion behaviors and thermal conductivity of Carbon-encapsulated copper nanoparticles in water with different dispersants were investigated under different pH values. The results showed that the dispersion and thermal conductivity enhancements of Carbon-encapsulated copper nanoparticles nanofluids are higher than that of copper nanoparticles.

Info:

Periodical:

Advanced Materials Research (Volumes 284-286)

Main Theme:

Edited by:

Xiaoming Sang, Pengcheng Wang, Liqun Ai, Yungang Li and Jinglong Bu

Pages:

801-805

DOI:

10.4028/www.scientific.net/AMR.284-286.801

Citation:

J. S. Pang et al., "Enhancement of Thermal Conductivity with Carbon-Encapsulated Copper Nano-Particle for Nanofluids", Advanced Materials Research, Vols. 284-286, pp. 801-805, 2011

Online since:

July 2011

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Price:

$35.00

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