Annealing Temperature Effect on the Microstructure and Adhesion of SiC Films Produced by MF Magnetron Sputtering

Yang Yang Li; Jun Jie Hao; Xiao Lu Pang

doi:10.4028/www.scientific.net/AMR.287-290.2423

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 287-290Annealing Temperature Effect on the Microstructure...

Annealing Temperature Effect on the Microstructure and Adhesion of SiC Films Produced by MF Magnetron Sputtering

Abstract:

SiC films were prepared by mid-frequency (MF) magnetron sputtering with graphite and poly-silicon targets on polycrystalline Al₂O₃ substrate. XPS analysis shows that the ratio of C/Si may change from 3.24 to 1.21 by adjusting the distance between target and substrate. SEM and XRD were used to investigate the surface morphology and microstructure of SiC films changing with annealing temperature. Results show that the microstructure of SiC started to be crystallized when the annealing temperature run up to 1200°C, and the film adhesion increased from 31N to 53N with the temperature changing from as-deposited to 1200 °C annealing, respectively.

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Periodical:

Advanced Materials Research (Volumes 287-290)

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2423-2428

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.287-290.2423

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Online since:

July 2011

Authors:

Yang Yang Li, Jun Jie Hao, Xiao Lu Pang

Keywords:

Annealing Temperature, Film Adhesion, Mf Magnetron Sputtering, SiC Film

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