Annealing Effects on Microstructure and Thermoelectric Properties of Bi2(Te0.95Se0.05)3 Thin Films Prepared by Flash Evaporation Method

Article Preview

Abstract:

N-type Bi2(Te0.95Se0.05)3 thermoelectric thin films with thickness 800 nm have been deposited on glass substrates by flash evaporation method at 473 K. The structures, morphology of the thin films were characterized by X-ray diffraction and field emission scanning electron microscope, respectively. Thermoelectric properties of the thin films have been evaluated by measurements of Seebeck coefficient and electrical resistivity at 300 K. Annealing effect on Seebeck coefficient and electrical resistivity of the thin films was examined in the temperature range 373–573 K. When annealed at 473 K for 1 h, Seebeck coefficient and electrical resistivity are –180 μV/K and 2.7 mΩcm, respectively. Thermoelectric power factor is improved to 12 µW/cmK2.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Pages:

2434-2437

Citation:

Online since:

July 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Lon E. Bell: Science Vol. 321 (2008), p.1457

Google Scholar

[2] V. D. Das and N. J. Soundararajan: J. Appl. Phys. Vol. 65 (1989), p.2332

Google Scholar

[3] H. Noro, K. Sato and H. Kagechika: J. Appl. Phys. Vol. 73 (1993), p.1252

Google Scholar

[4] L. D. Hicks and M. S. Dresselhaus: Phys. Rev. B Vol. 47 (1993), p.12727

Google Scholar

[5] A. Boulouz, S. Chakraborty, A. Giani, F. Pascal Delannoy, A. Boyer and J. Schumann: J. Appl. Phys. Vol. 89 (2001), p.5009

Google Scholar

[6] B. Aboulfarah, A. Mzerd, A. Giani, A. Boulouz, F. Pascal-Delannoy and A. Foucaran: Materials Chemistry and Physics Vol. 62 (2000), p.179

DOI: 10.1016/s0254-0584(99)00155-8

Google Scholar

[7] Feng Xiao, Carlos Hangarter, Bongyoung Yoo, Youngwoo Rheem, Kyu-Hwan Lee and Nosang V. Myung: Electrochimica Acta Vol. 53 (2008), p.8103

DOI: 10.1016/j.electacta.2008.06.015

Google Scholar

[8] D. Bourgault, C. Giroud Garampon, N. Caillault, L. Carbone and J.A. Aymami: Thin Solid Films Vol. 516 (2008), p.8579

DOI: 10.1016/j.tsf.2008.06.001

Google Scholar

[9] H.L. Zou, D. M. Rowe and G. Min: J. Cryst Growth Vol. 222 (2001), p.82

Google Scholar

[10] L.M. Goncalvesa, P. Alpuimb, Gao Minc, D.M. Rowec, C. Coutoa and J.H. Correiaa: Vacuum Vol. 82 (2008), p.1499

Google Scholar

[11] L.D. Hicks and M. S. Dresselhaus: Phys. Rev. B Vol. 53 (1996), p. R10493

Google Scholar

[12] R. Venkatasubramanian, E. Siivola and T. Coplitts: Nature Vol. 413 (2001). p.597

Google Scholar

[13] A. Giani, A. Boulouz, B. Aboulfarah, F. Pascal-Delannoy, A. Foucaranan and A. Boyer: Journal of Crystal Growth Vol. 204 (1999), p.91

DOI: 10.1023/a:1006670327086

Google Scholar

[14] R. S. Makala, K. Jagannadham and B. C. Sales: J. Appl. Phys. Vol. 94 (2003), p.3907

Google Scholar

[15] M. Takashiri, K. Miyazaki and H. Tsukamoto. Thin Solid Films 516 (2008), p.6336–6343.

DOI: 10.1016/j.tsf.2007.12.130

Google Scholar

[16] P. G. Ganesan and V. D. Das: Materials Letters. Vol. 60 (2006), p. (2059)

Google Scholar

[17] Cho Kyoung-Won and Kim II-Ho: Materials Letters Vol. 59 (2005), p.966

Google Scholar

[18] V. D. Das and S. Selvaraj: J. Appl. Phys. Vol. 86 (1999), p.1518

Google Scholar

[19] A. Foucaran, A. Sackda, A. Giani, F. Pascal-Delannoy and A. Boyer. Mater. Sci. Eng. B. Vol. 52 (1998), p.154

DOI: 10.1016/s0921-5107(98)00108-1

Google Scholar

[20] F. Volklein, V. Baier, U. Dillner and E. Kessler: Thin Solid Films Vol. 187 (1990), p.253

Google Scholar

[21] Bed Poudel, Qing Hao and Yi Ma: Science Vol. 320 (2008), p.634

Google Scholar

[22] J. Horak, P. Lostak and L. Benes: Philos Mag B Vol. 50 (1984), p.665

Google Scholar