Characterization of Ti-Al-N Films Deposited by Cathodic Vacuum Arc with Different N2 Partial Pressure

Abstract:

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A series of Ti-Al-N films were deposited on silicon wafer and steel substrates by cathodic vacuum arc technique in N2/Ar gas mixtures, using a compound Ti(50):Al(50) target. The chemical composition, crystalline microstructure, film deposition rate and surface morphology of the films were investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscope (SEM) coupled with an energy dispersive X-ray analysis system (EDX), respectively. The hardness and Young’s modulus, wear performance and corrosion behavior of the Ti-Al-N (multi-phase) films at different N2 partial pressure were analyzed and explained on the basis of microstructure, mechanical properties and wear mechanisms.

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Edited by:

Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li

Pages:

2429-2433

DOI:

10.4028/www.scientific.net/AMR.287-290.2429

Citation:

G.P. Zhang et al., "Characterization of Ti-Al-N Films Deposited by Cathodic Vacuum Arc with Different N2 Partial Pressure", Advanced Materials Research, Vols. 287-290, pp. 2429-2433, 2011

Online since:

July 2011

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Price:

$35.00

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