Characterization of Ti-Al-N Films Deposited by Cathodic Vacuum Arc with Different N₂ Partial Pressure

Abstract:

A series of Ti-Al-N films were deposited on silicon wafer and steel substrates by cathodic vacuum arc technique in N₂/Ar gas mixtures, using a compound Ti(50):Al(50) target. The chemical composition, crystalline microstructure, film deposition rate and surface morphology of the films were investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscope (SEM) coupled with an energy dispersive X-ray analysis system (EDX), respectively. The hardness and Young’s modulus, wear performance and corrosion behavior of the Ti-Al-N (multi-phase) films at different N₂ partial pressure were analyzed and explained on the basis of microstructure, mechanical properties and wear mechanisms.

• Periodical: Advanced Materials Research (Volumes 287-290)
• Pages: 2429-2433
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.287-290.2429
• Online since: July 2011
• Authors: G.P Zhang, X.Q Wang, G.H Lv, H Chen, H Pang, L Zhou, J Huang, W Chen, S.Z Yang
• Keywords: Cathodic Vocuum Arc, Nitrogen Partial Pressure, Ti-Al-N Films

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