Effect of TBC Residual Stresses by Uniform Growth of TGO and Typical Interface Topography

Zhi Ping Wang; Huan Wang; Zhi Yong Han; Qing Zhang

doi:10.4028/www.scientific.net/AMR.291-294.133

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Effects of Mg Addition on Thickness of Galvalume Coating: A First-Principles Study
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Investigation on High-Phosphorus Electroless Ni–P Plating Technology of Stainless Steel
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Effect of TBC Residual Stresses by Uniform Growth of TGO and Typical Interface Topography
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Toughing of ZrAlN Film through Superlattice Design
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Research on Strip Steel Surface Bright-Field and Dark-Field Images Fusion Method
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 291-294Effect of TBC Residual Stresses by Uniform Growth...

Effect of TBC Residual Stresses by Uniform Growth of TGO and Typical Interface Topography

Abstract:

Considering the thermally-growth oxide (TGO) that grows between ceramic coating and bond coat interface and surface topography of bond coat in a TBC system, the effect of residual stresses distribution by growth of TGO and cone interface topography in thermal barrier coating was calculated. The calculating result shows that the residual stress of TGO interface is affected by interface topography unit size and topography distribution density obviously. The stress between TGO and ceramic coating interface is greater than the stress between TGO and bond coat interface. Stress concentrates in topography center and the maximal value is 870MPa.The stress decreases with the increase of topography quantity.