Research of GaAs Polishing Uniformity on Non-Abrasive Cryogenic Conditions

Shou Ping Qu; Tian Zhu Liang; Zhong Shu Zhang

doi:10.4028/www.scientific.net/AMR.291-294.150

Paper Titles

Effect of TBC Residual Stresses by Uniform Growth of TGO and Typical Interface Topography
p.133

Microstructures and Strength of Hot-Rolled Mg-Zn-Y Alloys
p.137

Toughing of ZrAlN Film through Superlattice Design
p.141

Research on Strip Steel Surface Bright-Field and Dark-Field Images Fusion Method
p.146

Research of GaAs Polishing Uniformity on Non-Abrasive Cryogenic Conditions
p.150

Simulation of Inclusions Removal Influenced by Snorkel and Blowing Parameters in RH Refining
p.155

Surface Characteristics and Water Absorption of Sol-Gel Coated Impregnated Paper Pressed onto Plywood
p.159

Enhancement of Acid Resistance for Ultramarine Blue by Silica Coatings
p.163

TiC Particle Reinforced Reactive Plasma Cladding Composite Coating by the Precursor Carbonization-Composition Process
p.167

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 291-294Research of GaAs Polishing Uniformity on...

Research of GaAs Polishing Uniformity on Non-Abrasive Cryogenic Conditions

Abstract:

In the paper, it is introduced a new method of non-abrasive cryogenic polishing which is used to polish GaAs chips. It is also analyzed the influence of different factors on polishing surfaces and polishing uniformity. The rotate speed of work piece disk is a more important factor on impacting the polishing uniformity than offset e.

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Periodical:

Advanced Materials Research (Volumes 291-294)

Pages:

150-154

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.291-294.150

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Online since:

July 2011

Authors:

Shou Ping Qu, Tian Zhu Liang, Zhong Shu Zhang

Keywords:

Cryogenic Polishing, GaAs, Non-Abrasive, Polishing Uniformity

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