The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder

Ying Ming Shen; Fang Juan Qi; Min Xie; Jian Li

doi:10.4028/www.scientific.net/AMR.291-294.929

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Effect of Physical Simulation Thermal Parameters on Microstructure Transition and Property Variation of Boron Steel
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The Chemical Reactions in Solution Synthesis of Aluminum Alloy Brazing Fluorate Flux
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The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder
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Reaserch on Measurement of Residual Stresses in Flash-Butt-Weld Rails Using X-Ray Diffraction
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Study on Fatigue Crack Growth Rate of Welded Joint of Duplex Stainless Steel
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 291-294The Effect of Nano-Cu Particles on Mechanical...

The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder

Abstract:

The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties.

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Periodical:

Advanced Materials Research (Volumes 291-294)

Pages:

929-933

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.291-294.929

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Online since:

July 2011

Authors:

Ying Ming Shen, Fang Juan Qi, Min Xie, Jian Li

Keywords:

Mechanical Bend Fatigue Property, Nano-Cu Particles, Shearing Property, Sn-3.5Ag Lead-Free Solder

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References

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