Through scientific experiments, we studied the binder, diamond, solder, uniform distribution and heating curves in brazing. We selected DH temporary binder, compared two kinds of diamond, selected the diamond with fine thermal stability. The experiments adopted diamond with uniform templates, experimenting 13 kinds of solder of which 9 were mixed with diamond for comparison of brazing effects and thermal damage. We optimized solder and brazing process and comprehensive analyzed experimental results. The analysis showed a small amount of DH temporary binder residue in brazing, fine effect in case of low alloy solder brazing temperature, better adhesion of solder and diamond achieved by elements formed by Cr and other strong carbides, sufficient volatilization of temporary binder and other impurities achieved by insulation before 500°C, heating rate of 1°C/min when the temperature it is higher than 20°C-50°C, the solder melting point, and that cooling should be carried out under high vacuum, brazing diamond should have fine thermal stability.