Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB

Mei Yan; Wei Qiang Gao; Rui Sheng Xue; Jing Hua Yu

doi:10.4028/www.scientific.net/AMR.306-307.336

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 306-307Influence of Electroless Copper Deposition on the...

Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB

Abstract:

Si-Cu alloys have been prepared by electroless depositions with different process. Si-Cu/MCMB materials have been prepared by carbonization of the mixture of Si-Cu, MCMB and mesophase pitch. The influences of electroless deposition condition and heat-treatment temperature on the anodic performance of Cu-Si/MCMB have been studied. Compared with Si/MCMB, Si-Cu/MCMB has more stable cyclical performance. Furthermore, the Si-Cu/MCMB sample produced by cleaning and then electroless deposition on Si shows the better anodic performance than the Si-Cu/MCMB sample produced by direct electroless deposition on Si, because the former sample has more Cu contents than the latter sample.

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Advanced Materials Research (Volumes 306-307)

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336-339

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.306-307.336

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Online since:

August 2011

Authors:

Mei Yan, Wei Qiang Gao, Rui Sheng Xue, Jing Hua Yu

Keywords:

Anodic Performance, Electroless Deposition, Lithium-Ion Battery, MCMB, Silicon

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