Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB

Abstract:

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Si-Cu alloys have been prepared by electroless depositions with different process. Si-Cu/MCMB materials have been prepared by carbonization of the mixture of Si-Cu, MCMB and mesophase pitch. The influences of electroless deposition condition and heat-treatment temperature on the anodic performance of Cu-Si/MCMB have been studied. Compared with Si/MCMB, Si-Cu/MCMB has more stable cyclical performance. Furthermore, the Si-Cu/MCMB sample produced by cleaning and then electroless deposition on Si shows the better anodic performance than the Si-Cu/MCMB sample produced by direct electroless deposition on Si, because the former sample has more Cu contents than the latter sample.

Info:

Periodical:

Advanced Materials Research (Volumes 306-307)

Edited by:

Shiquan Liu and Min Zuo

Pages:

336-339

DOI:

10.4028/www.scientific.net/AMR.306-307.336

Citation:

M. Yan et al., "Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB", Advanced Materials Research, Vols. 306-307, pp. 336-339, 2011

Online since:

August 2011

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Price:

$35.00

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