ABS Fabrics Chemically Plated by Cu/Ni-P as Electromagnetic Shielding Material

Cheng Da Yu; Qi Bin Deng; Ping Li; Ming Cun Wang; Yong Feng Wang

doi:10.4028/www.scientific.net/AMR.306-307.385

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 306-307ABS Fabrics Chemically Plated by Cu/Ni-P as...

ABS Fabrics Chemically Plated by Cu/Ni-P as Electromagnetic Shielding Material

Abstract:

In this paper, a novel composite material of Acrylonitrile-Butadlene-Styrene resin (ABS)-based fabric coated with Cu/Ni-P was prepared via chemical redox plating technique. A series of such composite materials with varying thickness of Cu and Ni-P showed remarkable electromagnetic shielding ability. With the increase of Cu thickness, the shielding effect (SE) increased gradually, but leveled off after 1.5μm at a SE of about 70dB. Similarly, with the increase of the depth of Ni-P coats, the SE showed a trendency of gradual increase, and leveled off after 1.0μm at a SE of about 45dB. The optimum ABS/Cu/Ni-P was Cu 1.5μm and Ni-P 1.0μm unilaterally. The ABS/Cu/Ni-P composite material possessed excellent shielding ability in the range of 0.001-1000MHz at a stable SE of >80dB, and it also possessed ideal shielding effect in the range of >36GHz. But in the range of 10-18GHz, the shielding effect is slightly decreased gradually to about 60dB. So the ABS/Cu/Ni-P fabric composite is an ideal candidate for electromagnetic shielding material at low and high frequency radiations.

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Periodical:

Advanced Materials Research (Volumes 306-307)

Pages:

385-388

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.306-307.385

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Online since:

August 2011

Authors:

Cheng Da Yu, Qi Bin Deng, Ping Li, Ming Cun Wang, Yong Feng Wang

Keywords:

ABS Resin, Chemical Plating, Cu/Ni-P, Electromagnetic Shielding, Fabric

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