Stress Migration Induced Formation of Voids / Hillocks in Tungsten Films

Abstract:

Stress migration behaviors in Tungsten (W) films were investigated according to morphological characteristics and residual stress analysis. Results show that stress relaxtion induced formation of voids and hillocks strips, which resembles the void / hillock pair observed in Cu film electromigration experiments. Analysis indicate that the formation of chocolate sphere shaped W hillocks is intimately related to the atoms diffusivity.

• Periodical: Advanced Materials Research (Volumes 311-313)
• Pages: 1831-1834
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.311-313.1831
• Online since: August 2011
• Authors: Hao Liang Sun, Ming Wei
• Keywords: Hillock, Stress Relaxation, Tungsten Film, Void

References

[1] J. Klema, R. Pyle, E. Domangue, IEEE, Proceedings of the 22th International Reliability Physics Symposium, Las Vegas, NV, USA, April 3-5, 1984, p.1.

[2] J. Curry, G. Fitzgibbon, Y. Guan, R. Muollo, G. Nelson, A. Thomas, IEEE, Proceedings of the 22nd International Reliability Physics Symposium, Las Vegas, NV, USA, April 3-5, 1984, p.6.

DOI: 10.1109/irps.1984.362013

[3] W. M. Kuschke and E.Arzt: Appl. Phys. Lett. Vol. 64 (1994), p.1097.

[4] R. M. Keller, S. P. Baker and E. Arzt: J. Mater. Res. Vol.47 (1999), p.415.

[5] S. Park and S. Suresh: Acta Mater. Vol. 48 (2000), p.3169.

[6] P. S. Ho and J. K. Howard: Appl. Phys. Lett. Vol. 27 (1975) , p.261.

[7] L. N. Michael and C.U. Kim: J. Appl. Phys. Vol. 90 (2001), p.4370.

[8] R. J. Gleixner, B. M. Clemens and W.D. Nix: J. Mater. Res. Vol. 12 (1997) , p.2081.

[9] I. A. Ovid'ko, A. G. Sheinerman and E. C. Aifantis: Acta Mater. Vol. 56 (2008), p.2718.

[10] M. Itoh, M. Hori and S. Nadahara: J. Vac. Sci. Technol. B. Vol. 9 (1) (1991) , p.149.

[11] K. Y. Ahn: Thin Solid Films. Vol. 153 (1-3) (1987) , p.469.

[12] S. M. Rossnagel, I. C. Noyan and J. C. Cabral: J. Vac. Sci. Technol. B. Vol. 20 (5) (2002), p.2047.

[13] G. Abadias, S. Dub and R. Shmegera: Surf. Coat. Technol. Vol. 200 (2006), P. 6538.

[14] H. J. Gao, L. Zhang, W. D. Nix, C. V. Thompson and E. Arzt: Acta Mater. Vol. 47 (1999), p.2865.

[15] Y. L. Shen, Y. L. Guo and C. A. Minor: Acta Mater. Vol. 48 (2000), p.1667.

[16] M. Aoyagi: Thin Solid Films. Vol. 467 (2004), p.146.

[17] S. J. Hwang, W. D. Nix and Y. C. Joo: Acta Mater. Vol. 55 (2007), p.5297.

[18] W. B. Pennebaker: J. Appl. Phys. Vol. 40 (1969), p.394.

[19] W. W. Jung, S. K. Choi, S. Y. Kweon and S. J. Yeom: Appl. Phys. Lett. Vol.83 (2003), p.2160.