Stress Migration Induced Formation of Voids / Hillocks in Tungsten Films

Abstract:

Article Preview

Stress migration behaviors in Tungsten (W) films were investigated according to morphological characteristics and residual stress analysis. Results show that stress relaxtion induced formation of voids and hillocks strips, which resembles the void / hillock pair observed in Cu film electromigration experiments. Analysis indicate that the formation of chocolate sphere shaped W hillocks is intimately related to the atoms diffusivity.

Info:

Periodical:

Advanced Materials Research (Volumes 311-313)

Edited by:

Zhongning Guo

Pages:

1831-1834

DOI:

10.4028/www.scientific.net/AMR.311-313.1831

Citation:

H. L. Sun and M. Wei, "Stress Migration Induced Formation of Voids / Hillocks in Tungsten Films", Advanced Materials Research, Vols. 311-313, pp. 1831-1834, 2011

Online since:

August 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.