Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films

Hao Liang Sun; Ming Wei

doi:10.4028/www.scientific.net/AMR.311-313.1810

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Non-Uniform Simplification of Point Clouds
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Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films
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Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films

Abstract:

Tantalum (Ta) thin film was deposited onto Si (100) substrates using direct-current magnetron sputtering. The structure and mechanical properties of Ta films were investigated by X-ray diffraction, Field emission scanning electron microscope, and nanoindenter. The results indicated a transition from regular to irregular Hall-Petch relationship with decreasing grain size. Besides, a peak indentation hardness value of 12.8 GPa, much higher than that of bulk coarse-grained Ta, was obtained at the grain size of 36.3 nm.