Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films
Tantalum (Ta) thin film was deposited onto Si (100) substrates using direct-current magnetron sputtering. The structure and mechanical properties of Ta films were investigated by X-ray diffraction, Field emission scanning electron microscope, and nanoindenter. The results indicated a transition from regular to irregular Hall-Petch relationship with decreasing grain size. Besides, a peak indentation hardness value of 12.8 GPa, much higher than that of bulk coarse-grained Ta, was obtained at the grain size of 36.3 nm.
H. L. Sun and M. Wei, "Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films", Advanced Materials Research, Vols. 311-313, pp. 1810-1813, 2011