Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films

Abstract:

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Tantalum (Ta) thin film was deposited onto Si (100) substrates using direct-current magnetron sputtering. The structure and mechanical properties of Ta films were investigated by X-ray diffraction, Field emission scanning electron microscope, and nanoindenter. The results indicated a transition from regular to irregular Hall-Petch relationship with decreasing grain size. Besides, a peak indentation hardness value of 12.8 GPa, much higher than that of bulk coarse-grained Ta, was obtained at the grain size of 36.3 nm.

Info:

Periodical:

Advanced Materials Research (Volumes 311-313)

Edited by:

Zhongning Guo

Pages:

1810-1813

DOI:

10.4028/www.scientific.net/AMR.311-313.1810

Citation:

H. L. Sun and M. Wei, "Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films", Advanced Materials Research, Vols. 311-313, pp. 1810-1813, 2011

Online since:

August 2011

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$35.00

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