Experimental Research of Electrochemical Mechanical Polishing (ECMP) for Micro Tool Electrode
The mechanism of the elctrochemical mechanical polishing (ECMP) technology for micro tool electrode was investigated. In this paper, suitable major process parameters on the surface quality were evaluated, the major parameters contains electrical parameters, machining gap, the working fluid and other factors. In quantitative analyses, the process of the ECMP technology were conducted. The roughness of the workpiece was reduced from a relatively high value to a mirror effect.
S. Guo et al., "Experimental Research of Electrochemical Mechanical Polishing (ECMP) for Micro Tool Electrode", Advanced Materials Research, Vols. 314-316, pp. 1846-1850, 2011