Experimental Research of Electrochemical Mechanical Polishing (ECMP) for Micro Tool Electrode

Shuai Guo; Z.N Guo; Hong Ping Luo; Wen Cai Gu

doi:10.4028/www.scientific.net/AMR.314-316.1846

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 314-316Experimental Research of Electrochemical...

Experimental Research of Electrochemical Mechanical Polishing (ECMP) for Micro Tool Electrode

Abstract:

The mechanism of the elctrochemical mechanical polishing (ECMP) technology for micro tool electrode was investigated. In this paper, suitable major process parameters on the surface quality were evaluated, the major parameters contains electrical parameters, machining gap, the working fluid and other factors. In quantitative analyses, the process of the ECMP technology were conducted. The roughness of the workpiece was reduced from a relatively high value to a mirror effect.

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Advanced Manufacturing Technology, ADME 2011

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Periodical:

Advanced Materials Research (Volumes 314-316)

Pages:

1846-1850

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.314-316.1846

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Online since:

August 2011

Authors:

Shuai Guo, Z.N Guo, Hong Ping Luo, Wen Cai Gu

Keywords:

Compound Machining, ECMP, Micro Tool Electrode, Surface Quality

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References

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