Bonding of Aluminum Alloy by Hot-Dipping Tin Coating

Hui Diao; Chun Qing Wang; Lei  Wang

doi:10.4028/www.scientific.net/AMR.32.93

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Analytic Prediction of Structural Stress-Strain Relations of Microstructured Metal
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Experimental Research on Grain Orientation Evolution of Extruded Mg Alloy AZ31B Sheet during Uniaxial Tensile Deformation
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Bonding of Aluminum Alloy by Hot-Dipping Tin Coating
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Micro Impact Testing of Lead Free Solder Joints
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Evaluating Multi-Delamination of Composite Laminates Using an Active Sensor Network
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Optical and Piezoelectric Properties of ZnO Nanowires and Functional Polymer-Based Nanocomposites
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Tough Hypereutectic High Chromium White Iron – A Double In Situ Fibrous Composite
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 32Bonding of Aluminum Alloy by Hot-Dipping Tin...

Bonding of Aluminum Alloy by Hot-Dipping Tin Coating

Abstract:

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.