Residual Stress Estimation of Tungsten Film by GIXRD

Chao Chang Arthur Chen; Wei En Fu; Meng Ke Chen

doi:10.4028/www.scientific.net/AMR.32.75

Paper Titles

Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles
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Deposition and Properties Studies of Superfine TiN Films with Magnetic Filter
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Environmental Response of Plasma Sprayed Nanostructured Coatings
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Residual Thermal Stresses in a Fe₃Al/Al₂O₃ Gradient Coating System
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Residual Stress Estimation of Tungsten Film by GIXRD
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Stress Corrosion Cracking of NiTi Orthodontic Wires in Sodium Fluoride Solution
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Analytic Prediction of Structural Stress-Strain Relations of Microstructured Metal
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Experimental Research on Grain Orientation Evolution of Extruded Mg Alloy AZ31B Sheet during Uniaxial Tensile Deformation
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Bonding of Aluminum Alloy by Hot-Dipping Tin Coating
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Residual Stress Estimation of Tungsten Film by GIXRD

Abstract:

Subsurface residual stresses of tungsten films induced by Chemical Mechanical Polishing (CMP) processes were investigated by the Grazing Incident X-Ray Diffraction (GIXRD). Basis of the GIXRD measurement was introduced and the experiments were conducted for residual stress of tungsten film measurements. Experimental procedures of the GIXRD measurements were presented. The obtained residual stresses value of tungsten films from 800 nm to 400 nm varies from 1086.1 ± 105.2 MPa to 1670.6±103.4 MPa prior and after CMP process.