Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles

Abstract:

Article Preview

In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analyzed.

Info:

Periodical:

Edited by:

John Bell, Cheng Yan, Lin Ye and Liangchi Zhang

Pages:

57-60

DOI:

10.4028/www.scientific.net/AMR.32.57

Citation:

R. X. Bai et al., "Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles", Advanced Materials Research, Vol. 32, pp. 57-60, 2008

Online since:

February 2008

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Price:

$35.00

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