Influence of Low Boiling Point Nonsolvents on Morphologies of PA6 Electrospun Fibers
In the present contribution, ultra-high molecular polyamide 6 (PA6) solutions were prepared in various pure and mixed-solvent systems and later electrospun with the polarity of the emitting electrode. The PA6 concentration in the as-prepared solutions was fixed at 4 wt%. Some of the solution properties, i.e., surface tension, and conductivity, were measured. In the mixed-solvent systems, formic acid (FA) was blended with dichloromethane (DCM), trichloromethane (THM), and acetone, the influences of low boiling point nonsolvents on morphological appearance and sizes of the resulting PA6 electrospun fibers were also investigated.
Xiaoming Qian and Huawu Liu
Q. X. Jia et al., "Influence of Low Boiling Point Nonsolvents on Morphologies of PA6 Electrospun Fibers", Advanced Materials Research, Vols. 332-334, pp. 1322-1325, 2011