Influence of Low Boiling Point Nonsolvents on Morphologies of PA6 Electrospun Fibers

Abstract:

Article Preview

In the present contribution, ultra-high molecular polyamide 6 (PA6) solutions were prepared in various pure and mixed-solvent systems and later electrospun with the polarity of the emitting electrode. The PA6 concentration in the as-prepared solutions was fixed at 4 wt%. Some of the solution properties, i.e., surface tension, and conductivity, were measured. In the mixed-solvent systems, formic acid (FA) was blended with dichloromethane (DCM), trichloromethane (THM), and acetone, the influences of low boiling point nonsolvents on morphological appearance and sizes of the resulting PA6 electrospun fibers were also investigated.

Info:

Periodical:

Advanced Materials Research (Volumes 332-334)

Edited by:

Xiaoming Qian and Huawu Liu

Pages:

1322-1325

DOI:

10.4028/www.scientific.net/AMR.332-334.1322

Citation:

Q. X. Jia et al., "Influence of Low Boiling Point Nonsolvents on Morphologies of PA6 Electrospun Fibers", Advanced Materials Research, Vols. 332-334, pp. 1322-1325, 2011

Online since:

September 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.