Research on the Distributions of Thick and Thin Defects in the Electronic Testing for Raw Silk

Qi Hu; Qiong Wang; Jian Mei Xu; Jian Tao Niu; Lun Bai

doi:10.4028/www.scientific.net/AMR.332-334.87

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 332-334Research on the Distributions of Thick and Thin...

Research on the Distributions of Thick and Thin Defects in the Electronic Testing for Raw Silk

Abstract:

Thick defects and thin defects are the important targets of assessing the quality of the raw silk. To rationally establish the grading standards of raw silk, the frequency distributions of thick and thin defects of the raw silk should be found out. For this purpose, tests by the raw silk electronic detector were done to investigate the frequency distributions of thick and thin defects in the electronic testing for raw silk, and the fact that the thick and thin defects appropriately take negative binomial distribution as well as Neyman distribution in the electronic testing was confirmed by fitting test.