Preparation of Silver Nanoplates and Application in PCB Ink-Jet

Abstract:

Compared with traditional etch processing, inkjet technology has the features of simpler workmanship, less resources-utilizing, lower cost and environmentally friendly adaptation, which is sure to be another innovation of printed circuit board(PCB) technology. In this paper, size and shape controlled silver nanoparticles have been synthesized，which was used as conductive medium in ink-jet inks. Then it was printed into conductive lines on epoxy resin by a drop-on-demand inkjet printer. PVP was used as a polymeric stabilizer providing both electrostatic and steric stabilization. Ag₂C₂O₄ was used to prepared spherical nano-silver. In the preparation of flake-like silver powders, the fully inorganic phase system contains AgNO₃ as a silver precursor, DMF as a as a media dissolving silver salt, and PVP as a reducing reagent. The morphologies and structures of the nanoparticles were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). It was shown that the sample is silver with cubic asymmetry from the pattern of XRD. TEM images indicated that the size of spherical nano-particles was no more than 20 nm. But the small triangular nanoplates, with rather narrow size distribution, were in the range from 20nm up to 60 nm in edge length. The electrical conductivity was also measured by the four-probe tested method after calcined on the substrates. It was shown that the conductivity was 25S/cm when adding the spherical powders and the nano-silver ink has been successfully designed for inkjet printing.

• Periodical: Advanced Materials Research (Volume 380)
• Pages: 129-132
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.380.129
• Online since: November 2011
• Authors: Jian Yang, Jia Hai Chu, Yao Yang, Yu Bao Guo, Xi Gang Lou, Hou Bin Li
• Keywords: Conductive Ink, Ink-Jet, Nano-Silver, PCB

References

[1] Zhenguo Yang: Printed Circuit Information Vol. 9 (2008), pp.9-12.

[2] Jindu Lin: Printed Circuit Information Vol. 4 (2008), pp.8-13.

[3] A.L. Dearden, P.J. Smith, D.Y Shin, et al.: Macromol. Rapid Commun Vol. 26 (2005), pp.315-318.

[4] B.K. Park, D.Kim, S.Jeong, et al.: Thin Solid Films Vol. 515 (2007), pp.7706-7711.

[5] Lina Ji, Xiaofeng Tang, Zhenguo Yang: Ink-Jet Printing Technology Vol. 6 (2009), pp.26-30.

[6] Y. Sun, B. Mayers, T. Herricks, Y. Xia: Nano Lett Vol. 3 (2003), p.955.

[7] Y. Sun, Y. Xia: Science Vol. 298 (2002), p.2176.

[8] A.R. Tao, S. Habas, P. Yang: Small Vol. 3 (2008), p.310.

[9] S. Chen, Z. Fan, D.L. Carroll, J. Phys: Chem. B Vol. 106 (2002), p.10777.

[10] M. Maillard, S. Giorgio, M. Pileni: Adv. Mater Vol. 14 (2002), p.1084.

[11] I. Pastoriza-Santos, L.M. Liz-Marzan: Nano Lett Vol. 2 (2002), p.903.

[12] I. Washio, Y. Xiong, Y. Yin, Y. Xia: Adv. Mater Vol. 18 (2006), p.1745.

[13] C.R. Rocha Tulio, Z. Daniela, J. Nanosci: Nanotechnol Vol. 7 (2007), p.618.

[14] Lu Qi, Lee Kun-Jae: Journal of Colloid and Interface Science Vol. 342 (2010), pp.8-17.

[15] Kai Zou, Xiaohong Zhang, Shikang Wu: Acta Chimica Sinica Vol. 62 (2004), pp.1771-1774.