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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 391-392Research Progress of Heat Hv Insulation Resistance...

Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials

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Abstract:

Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.

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Chemical Engineering and Material Properties

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Periodical:

Advanced Materials Research (Volumes 391-392)

Pages:

332-335

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.391-392.332

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Online since:

December 2011

Authors:

Yong Peng Yu

Keywords:

Epoxy Resin (ER), High-Performance, Wet-Heat Resistance

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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