Theoretical Account for the Bimetallic Bonding of the Copper Clad Aluminum Wire by Clad-Drawing at Room Temperature

Abstract:

By analysis of the theoretical calculation, it is obvious that the bimetallic bonding of the copper clad aluminum wire by clad drawing at room temperature is the action results of collective gravitation of a great lot of two metal surface atoms reciprocally by outside force. The interatomic potential energy of the closer atoms of two metal surfaces is obvious lower, so as to change for electron within the distance. The interdiffusion of the bimetallic surface atoms by clad drawing at room temperature, is good for improving the bond strength, but is not necessary.

• Periodical: Advanced Materials Research (Volumes 391-392)
• Pages: 37-41
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.391-392.37
• Online since: December 2011
• Authors: Yu Mei Dai, Yong Qing Ma, Yu Jie Dai
• Keywords: Bimetallic Bonding, Clad Drawing, Copper Clad Aluminum, Theoretical Account

References

[1] BAY N.: Welding Journal Vol. 2 (1983), p.137.

[2] BAY N.: Metal Construction Vol. 6 (1986), p.369.

[3] BAY N.: Metal Construction Vol. 8 (1986), p.486.

[4] ZANG W, BAY N: CIRP Annals Vol. 41(1992), p.293.

[5] SENRI J, SAKAE S, KATHUHIKO S: J Mater. Process Tech Vol. 45 (1994), p.395.

[6] LIU Yanxia, WANG Xun, MA Yongqing: Computational Materials Science Vol. 44 (2008), p.641.

[7] DAI Yumei, WANG Xun, DAI Yujie, MA Yongqing: Journal of Computational and Theoretical Nanoscience Vol. 5 (2008), p.1665.

[8] KITTEL C.: Introduction to Solid State Physics (Science Press, Beijing 1979).

[9] HASHIMOTO T., OKAMOTO I.: Solid-phase welding and brazing (Sanpo Publications Inc., Japan 1979).

[10] MA Weijing, SHI Ziyuan, GAO Hongtao: Journal of functional materials Vol. 28 (1997), p.80.

[11] Andrew R. L.: Molecular Modeling: Principle and Practice (Springer-Verla, Berlin Heidelberg 1996).