Microstructure and Properties of Ultrafine Grained Cu-0.73%Cr Alloy after High Pressure Torsion

Kun Xia Wei; Wei Wei; Igor V. Alexandrov; Qing Bo Du; Jing Hu

doi:10.4028/www.scientific.net/AMR.391-392.385

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 391-392Microstructure and Properties of Ultrafine Grained...

Microstructure and Properties of Ultrafine Grained Cu-0.73%Cr Alloy after High Pressure Torsion

Abstract:

Microstructure, mechanical properties and electrical conductivity in Cu-0.73%Cr alloy after HPT process and the subsequent aging treatment have been investigated. Ultrafine grained structure with the grain size ~150 nm has been achieved after the HPT and the subsequent aging treatment. Ultrafine grains with some growth twins were preserved in the overaged state, showing high thermal stability. The peak microhardness and tensile strength of Cu-0.73%Cr alloy after the HPT was found at 480 °C for 2 hours. Electrical conductivity shows an increase trend in the different aging states.

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Periodical:

Advanced Materials Research (Volumes 391-392)

Pages:

385-389

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.391-392.385

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Online since:

December 2011

Authors:

Kun Xia Wei, Wei Wei, Igor V. Alexandrov, Qing Bo Du, Jing Hu

Keywords:

Cu-Cr Alloy, High Pressure Torsion (HPT), Microstructure, Property Analysis, Ultra-Fine Grain (UFG)

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